Item | Manufacture Capability |
---|---|
Layers | 1-8 |
Material | FR-4 |
Board Thickness | .016”- 0.1”(0.4mm-2.5mm) |
Copper Thickness | 0.5 oz-2oz(18um-70um) |
Board size | 500x500mm |
Min Tracing/Spacing | 0.127mm (5mil) |
Min Annular Ring | 0.15mm(6mil) |
Min drilling Hole diameter | 0.25mm(10mil) |
Min width of cutout (NPTH) | 0.8mm |
Min width of slot hole (PTH) | 0.6mm |
Solder Mask | LPI,different colors(Green,Black,White,Red,Yellow,Blue) |
Silkscreen color | White,Black |
Surface finish | HASL,Lead Free HASL,ENIG (1-5 micro inches) |
Max.thickness of Au in ENIG | 3-5 micro inches |
Surface/Hole plating thickness | 20-30um |
Board thickness tolerance | +/-0.1mm ~ +/-10% of thickness of board |
Board size tolerance | +/-0.1mm~+/-0.3mm |
PTH hole size tolerance | +/-.003”(+/-0.08mm)~+/-.006”(+/-0.15mm) |
NPTH hole size tolerance | +/-.002”(+/-0.05mm) |
Copper thickness tolerance | 0um ~ +20um |
SM tolerance(LPI) | .003”(0.075mm) |
SMD Pitch | 0.2mm(8mil) |
BGA Pitch | 0.25mm(10mil) |
Aspect Ratio | 1:8 (hole size:board thickness) |
Test | 10V-250V,flying probe or testing fixture |
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